Hybrid Chips

Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C

Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C